Consultant Post in IIT Bhilai via Direct Recruitment
Event Status : Created Event
Timeline
Important Dates
Application Closing Date | 11/01/2023 |
Application Opening Date | 06/01/2023 |
Other Important Information
Appointment Type | Research Fellowship, Direct Recruitment |
Application Submission Method | Online |
Age Limit | 18-35 |
Qualification Required | Postgraduate, Graduate |
Total Vacancies | 1 |
Location of Posting/Admission | Raipur District, Chhattisgarh, India, 493111 |
Interview | Yes |
Post Type | Contractual |
Place of Posting/Admission | Raipur, Chhattisgarh, India |
Salary | 60000 |
Work Experience | Yes |
Organisation Type | Educational Institution |
Website | https://www.iitbhilai.ac.in/ |
Note: This information is common for all posts. For details on specific posts, refer to the official notification.
Posts Released
Important Updates
Refer to the official notification for more details.
Application Summary
Indian Institute of Technology Bhilai invites applications for the following posts via direct recruitment:
Post Name: Consultant
Essential Qualification: M.Arch, M.Plan, or M.U.R.P along with B.Arch from CoA recognized institute/university.
Desirable:
The project will involve extensive site documentation and stakeholder interaction at Barsur, a nagar panchayat in Dantewada, Chhattisgarh. Candidates should apply keeping the same in mind. Candidates with the following will be given preference:
Experience of and exposure to issues and stakeholders in fields of heritage conservation and/or management in Dantewada
Working knowledge of geo-spatial techniques and software
Adept at 3D visualization and rendering software (Sketchup & Lumion)
Registered member of Council of Architecture
Interdisciplinary research background and previous research experience
Prior research in the aspects of sustainable development of the project region
Application can be sent via email to anubhavp@iitbhilai.ac.in
For more details related to eligibility criteria, fee, pattern, annexure, place of posting etc. refer to the attachments below.