Junior Research Fellow post in IIITDM via Walk-in-Interview
Event Status : Created Event
Timeline
Important Dates
Application Opening Date | 12/12/2022 |
Application Closing Date | 12/12/2022 |
Date of Interview | 12/12/2022 |
Other Important Information
Appointment Type | Walk-In-Interview |
Application Submission Method | Online |
Total Vacancies | 1 |
Location of Posting/Admission | Jabalpur District, Madhya Pradesh, India, 483222 |
Exam | CSIR NET, GATE, UGC NET |
Place of Posting/Admission | Jabalpur, Madhya Pradesh, India |
Post Type | Contractual |
Salary | 31000 |
Website | https://www.iiitdmj.ac.in/ |
Organisation Type | Educational Institution |
Interview | Yes |
Note: This information is common for all posts. For details on specific posts, refer to the official notification.
Posts Released
Important Updates
Refer to the official notification for more details.
Application Summary
Indian Institute of Information Technology Design and Manufacturing Jabalpur invites application from eligible candidates for Walk-in-Interview for the following posts:
Post Name: Junior Research Fellow
Essential Qualification:
M.Tech. degree in EE/ ECE/ VLSI/ Nanotechnology/ Material Science
M.Sc. in Electronics/ Nanotechnology/ Material Science and a valid GATE / NET JRF score
B.Tech. candidates with degree in EE/ ECE/ VLSI/ Nanotechnology/ Material Science AND a valid GATE score
Desirable: Candidates having hands-on experience of working in nanofabrication laboratory and knowledge of simulation and modelling tools such as MATLAB will be given preference
Address to send the application: The Candidate must fill in the application form and send it to PDPM-Indian Institute of Information Technology, Design & Manufacturing Jabalpur Dumna Airport Road, P.O. Khamaria, Jabalpur-482005 Email: pankaj.sharma@iiitdmj.ac.in, Mobile No.: 9893805618 along with relevant documents.
Application send via email to pankaj.sharma@iiitdmj.ac.in
For more details related to eligibility criteria, fee, pattern, annexures, place of posting etc. refer to the attachments below.