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  • M.Tech and 1 Other Programme in National Institute Of Technology Sikkim For Academic Session 2022

    Event Status : Provisionally Selected Candidates List Released

Timeline

Important Dates

Result Available
23/08/2022
Application Closing Date
24/07/2022
Application Opening Date
20/06/2022

Other Important Information

Admission Bases
Course Admission
Application Submission Method
Composite
Examination Mode
Offline
Qualification Required
Graduate
Stream
Engineering, Science
Application Fee
Yes
Location of Posting/Admission
Namchi District, Sikkim, India, 737139
Exam
GATE
Website
www.nitsikkim.ac.in
Organisation Type
Educational Institution
Interview
Yes
Examination Centre
Regional
Educational Credential Awarded
Degree
Place of Posting/Admission
Ravangla, Sikkim 737139, India

Note: This information is common for all posts. For details on specific posts, refer to the official notification.

Courses Released

1. Master of Technology
2. Master of Science

Important Updates

Refer to the official notification for more details.

Application Summary

National Institute Of Technology Sikkim has released notifications for the Master of Technology and Master of Science programs. Interested candidates can apply from 20/06/2022 to 24/07/2022. Download the official prospectus for details on eligibility, program information, admission procedure, fee structure, and more.

National Institute Of Technology Sikkim invites online application from eligible candidates for admission in postgraduate programme. The important details of the admission process are listed below -

Course name :

(1) Master of Technology

(2) Master of Science

Address to send the application : Candidate must fill in the application form and send it to To Convener, Institute Admission Test 2022 Academic Section, National Institute of Technology Sikkim Ravangla, South Sikkim, PIN 737139, India

Application can also be sent via email to IAT@nitsikkim.ac.in

For more details related to eligibility criteria, syllabus, fee, pattern, annexures etc refer to the attachments below.