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  • Project Technical Support-III (Project Technical Assistant) Post in ICMR-NIN via Walk-In-Interview

    Event Status : Created Event

Timeline

Important Dates

Application Opening Date
30/01/2024
Application Closing Date
30/01/2024
Date of Interview
30/01/2024

Other Important Information

Appointment Type
Walk-In-Interview
Application Submission Method
Offline
Age Limit
18-35
Qualification Required
Graduate, Postgraduate
Total Vacancies
1
Advertisement Number
297/Projects/JAN/2024
Location of Posting/Admission
Hyderabad District, Telangana, India, 500028
Salary
25000
Post Type
Contractual
Interview
Yes
Work Experience
Yes
Place of Posting/Admission
Hyderabad, Telangana, India
Organisation Type
Non-Educational Institution
Website
https://www.nin.res.in/

Note: This information is common for all posts. For details on specific posts, refer to the official notification.

Posts Released

1. Project Technical Support-III
2. Project Technical Assistant

Important Updates

Refer to the official notification for more details.

Application Summary

ICMR National Institute of Nutrition has released notifications for the Project Technical Support-III and Project Technical Assistant posts. Interested candidates can apply from 30/01/2024 to 30/01/2024. Download the official notification for details on eligibility, post information, job procedure, pay scale, and more.

ICMR National Institute of Nutrition invites application from eligible candidates for Walk-in-Interview for the following post:

Post Name: Project Technical Support-III (Project Technical Assistant)

Essential Qualification: 

  • Graduate in Biochemistry / Biotechnology / Nutrition / Applied Nutrition from a recognized University with three years of work experience from a recognized Institution Or

  • MSc in Biochemistry / Biotechnology / Nutrition / Applied Nutrition from recognized University

Place of Interview: Conference Hall, ICMR-NIN, Hyderabad

For more details related to eligibility criteria, fee, pattern, annexures, place of posting etc. refer to the attachments below.