Exam Path Finder
Select Item
organisation_logo
  • Research Fellow Post in PAU via Direct Recruitment

    Event Status : Created Event

Timeline

Important Dates

Date of Interview
24/07/2023
Application Closing Date
19/07/2023
Application Opening Date
03/07/2023

Other Important Information

Appointment Type
Direct Recruitment, Research Fellowship
Application Submission Method
Offline
Qualification Required
Graduate, Postgraduate
Total Vacancies
1
Application Fee
Yes
Location of Posting/Admission
Ludhiana District, Punjab, India, 141421
Organisation Type
Educational Institution
Website
https://www.pau.edu/
Place of Posting/Admission
Ludhiana, Punjab, India
Interview
Yes
Salary
31000
Department/Subject
Soil Science
Work Experience
Yes

Note: This information is common for all posts. For details on specific posts, refer to the official notification.

Posts Released

1. Research Fellow

Important Updates

Refer to the official notification for more details.

Application Summary

Punjab Agricultural University has released a notification for the Research Fellow post. Interested candidates can apply from 03/07/2023 to 19/07/2023. Download the official notification for details on eligibility, post information, job procedure, pay scale, and more.

Punjab Agricultural University invites applications for the following posts via direct recruitment :

Post Name : Research Fellow

Essential Qualification :

(1) B.Sc./B.Sc. (Agriculture) with minimum OCPA 6.00/10.00 basis or 60% marks.

(2) M.Sc. in Soil Science/Chemistry/Life Sciences with minimum OCPA 6.50/10.00 basis or 65% marks.

Desirable: Preference will be given to candidate who has previous experience of working in the field conditions and analyzing plant and soil samples in the laboratory.

Address to send the application: The Candidate must fill in the application form and send it to Punjab Agricultural University, Ludhiana, Punjab along with relevant documents.

For more details related to eligibility criteria, fee, pattern, annexure, place of posting etc. refer to the attachments below.