Junior Engineer Post in SAU via Walk-In-Interview
Event Status : Created Event
Timeline
Important Dates
Application Closing Date | 30/01/2023 |
Date of Interview | 30/01/2023 |
Application Opening Date | 23/01/2023 |
Other Important Information
Appointment Type | Walk-In-Interview |
Application Submission Method | Offline |
Age Limit | 18-40 |
Qualification Required | Graduate, Diploma |
Total Vacancies | 2 |
Advertisement Number | 1/2023 |
Application Fee | Yes |
Location of Posting/Admission | New Delhi, Delhi, India, 110011 |
Salary | 50000 |
Post Type | Contractual |
Interview | Yes |
Work Experience | Yes |
Organisation Type | Educational Institution |
Place of Posting/Admission | New Delhi, Delhi, India |
Website | http://www.sau.int/ |
Note: This information is common for all posts. For details on specific posts, refer to the official notification.
Posts Released
Important Updates
Refer to the official notification for more details.
Application Summary
South Asian University invites application from eligible candidates for Walk-in-Interview for the following posts:
Post Name: Junior Engineer
Essential Qualification: A Degree in Electrical/Mechanical Engineering with at least 3 years experience, or a Diploma with at least five years experience in the supervision of execution / maintenance of electrical/mechanical works in PSU/Government/University/international organisation/institute of repute Successful candidate must also have good knowledge of computer applications and internet strong interpersonal skills good writing and speaking skills strong ethical convictions and a commitment to quality service and the ability to competently interact with a culturally and ethnically diverse population of students, faculty, and staff.
Place of Interview: South Asian University, Rajpur Road, Maidan Garhi, New Delhi–110068
Address to send the application: The Candidate must fill in the application form and send it to Registrar, South Asian University, Rajpur Road, Maidan Garhi, New Delhi–110068 along with relevant documents.
For more details related to eligibility criteria, fee, pattern, annexures, place of posting etc. refer to the attachments below.
