Research Associate and 1 Other Post in University of Hyderabad via Direct Recruitment
Event Status : Created Event
Timeline
Important Dates
Application Closing Date | 04/02/2023 |
Application Opening Date | 29/01/2023 |
Other Important Information
Appointment Type | Direct Recruitment |
Application Submission Method | Composite |
Qualification Required | Postgraduate, Doctorate |
Total Vacancies | 2 |
Location of Posting/Admission | Hyderabad District, Telangana, India, 500028 |
Place of Posting/Admission | Hyderabad, Telangana, India |
Website | www.uohyd.ac.in |
Organisation Type | Educational Institution |
Post Type | Contractual |
Work Experience | Yes |
Interview | Yes |
Salary | 20000, 16000 |
Note: This information is common for all posts. For details on specific posts, refer to the official notification.
Posts Released
Important Updates
Refer to the official notification for more details.
Application Summary
University of Hyderabad invites applications for the following posts via direct recruitment :
Post Name : Research Associate
Essential Qualification : Post Graduate in Economics/Social Sciences/allied subjects with at least 50% marks.
Desirable : PhD in Economics/Social Sciences/allied subjects with experience in quantitative techniques and software will be preferred. Knowledge of English and Nagamese is desirable.
Post Name : Research Assistant
Essential Qualification : Post Graduate in Economics/Social Sciences/allied subjects with at least 50% marks. Knowledge of quantitative techniques and software is required.
Address to send the application: The Candidate must fill in the application form and send it to Dr. S Limakumba Walling, Assistant Professor (Principal Investigator), School of Economics, University of Hyderabad, Prof. C.R. Rao Road, Central University P.O., Gachibowli, Hyderabad, PIN – 500046. along with relevant documents.
Application can also be sent via email to limawalling@uohyd.ac.in
For more details related to eligibility criteria, fee, pattern, annexure, place of posting etc. refer to the attachments below.