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  • Project Associate -II Post in MAHE via Direct Recruitment

    इवेंट की स्थिति : Created Event

घटनाक्रम

महत्वपूर्ण तिथियाँ

Application Closing Date
02/04/2024
Application Opening Date
27/03/2024

अन्य महत्वपूर्ण जानकारी

Appointment Type
Direct Recruitment
Application Submission Method
Online, Offline
Qualification Required
Postgraduate
Total Vacancies
1
Location of Posting/Admission
Udupi District, Karnataka, India, 576101
Exam
CSIR NET, GATE, UGC NET
Website
https://www.manipal.edu/
Place of Posting/Admission
Udupi, Karnataka, India
Organisation Type
Educational Institution
Salary
35000
Post Type
Contractual
Interview
Yes

नोट: यह जानकारी सभी पदों के लिए सामान्य है। विशिष्ट पदों से संबंधित विवरण के लिए, कृपया आधिकारिक अधिसूचना देखें।

जारी की गई पोस्ट्स

1. Project Associate-II

महत्वपूर्ण अपडेट

अधिक जानकारी के लिए आधिकारिक अधिसूचना देखें।

एप्लीकेशन सारांश

Manipal Academy of Higher Education has released a notification for the Project Associate-II post. Interested candidates can apply from 27/03/2024 to 02/04/2024. Download the official notification for details on eligibility, post information, job procedure, pay scale, and more.

Manipal Academy of Higher Education invites applications for the following posts via direct recruitment:

Post Name:Project Associate-II

Essential Qualification: Postgraduate in M.E./MTech in Biomedical/ Electronics and Communication/ Electronics and Electrical Engineering/ Instrumentation/ VLSI/ Microelectronics/Embedded Systems/Related Circuit Branches with at least 60% marks (Candidates with CSIR/NET/GATE/National level examination conducted by central government departments are encouraged to apply)

Address to send the application: The Candidate must fill in the application form and send it to The Director – HR Manipal Academy of Higher Education Manipal - 576104, Karnatakaalong with relevant documents.

Application can also be sent via email to jobs.research@manipal.edu

For more details related to eligibility criteria, fee, pattern, annexure, place of posting etc. refer to the attachments below.