Project Assistant and 1 Other Post in Ram Lal Anand College via Walk-In-Interview
Event Status : Created Event
Timeline
Important Dates
Application Opening Date | 14/02/2023 |
Application Closing Date | 14/02/2023 |
Date of Interview | 14/02/2023 |
Other Important Information
Appointment Type | Walk-In-Interview |
Application Submission Method | Offline |
Age Limit | 18-32 |
Qualification Required | Graduate, Postgraduate |
Total Vacancies | 2 |
Advertisement Number | RLAC/2023/1287 |
Location of Posting/Admission | New Delhi, Delhi, India, 110011 |
Interview | Yes |
Post Type | Contractual |
Salary | 31000, 32000 |
Age Relaxation Type | SC/ST, Other Backward Class |
Place of Posting/Admission | New Delhi, Delhi, India |
Organisation Type | Educational Institution |
Website | https://rlacollege.edu.in/ |
Note: This information is common for all posts. For details on specific posts, refer to the official notification.
Posts Released
Important Updates
Refer to the official notification for more details.
Application Summary
Ram Lal Anand College invites application from eligible candidates for Walk-in-Interview for the following posts:
Post Name: Project Assistant
Essential Qualification:
Graduate in Computer Science from a recognised university with (preferably) three years work experience from a recognized Institution. OR
Masters degree in the Computer Science subjects.
Post Name: Computer Programmer (Grade-A)
Essential Qualification:
Masters Degree in Computer Application/ Information Technology/ Computer Science from a recognised institution/ University. OR
B.E./ B.Tech in Computer Engineering/ Computer Science/ Computer Technology/ Information Technology from a recognised institution/ university.
Desirable: Working knowledge of Deep Learning Frameworks (PyTorch or Tensorflow or Keras) and strong in Python programming.
Place of Interview: Principal Office, Ram Lal Anand College, Benito Juarez Road, New Delhi.
For more details related to eligibility criteria, fee, pattern, annexures, place of posting etc. refer to the attachments below.