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  • Junior Research Fellow Post in NIT Silchar via Direct Recruitment

    इवेंट की स्थिति : Last Date Extended

घटनाक्रम

महत्वपूर्ण तिथियाँ

Application Closing Date
12/10/2023
Application Opening Date
06/09/2023

अन्य महत्वपूर्ण जानकारी

Appointment Type
Direct Recruitment, Research Fellowship
Application Submission Method
Online
Age Limit
18-32
Qualification Required
Postgraduate, Graduate
Total Vacancies
1
Advertisement Number
NITS/Dean (RC)/CE/620/01/2023
Location of Posting/Admission
Cachar District, Assam, India, 788101
Salary
31000
Age Relaxation Type
SC/ST, Other Backward Class
Interview
Yes
Work Experience
Yes
Website
http://www.nits.ac.in/
Organisation Type
Educational Institution
Place of Posting/Admission
Silchar, Assam, India
Department/Subject
Civil Engineering

नोट: यह जानकारी सभी पदों के लिए सामान्य है। विशिष्ट पदों से संबंधित विवरण के लिए, कृपया आधिकारिक अधिसूचना देखें।

जारी की गई पोस्ट्स

1. Junior Research Fellow

महत्वपूर्ण अपडेट

अधिक जानकारी के लिए आधिकारिक अधिसूचना देखें।

एप्लीकेशन सारांश

National Institute of Technology Silchar has released a notification for the Junior Research Fellow post. Interested candidates can apply from 06/09/2023 to 12/10/2023. Download the official notification for details on eligibility, post information, job procedure, pay scale, and more.

National Institute of Technology Silchar invites applications for the following posts via direct recruitment:

Post Name: Junior Research Fellow

Essential Qualification: Master degree in Geotechnical Engineering/ relevant disciple or Bachelor degree in Civil Engineering (Minimum 8 CPI/CGPA) with excellent academic records from reputed recognized Institutes/Universities

Desirable: Research/project experience in the field of Geotechnical Engineering or Earthquake engineering, experience in field testing/geophysical testing, knowledge of use of FEM based software.

Application send via email to debjit@civil.nits.ac.in

For more details related to eligibility criteria, fee, pattern, annexure, place of posting etc. refer to the attachments below.