Junior Research Fellow Post in NIT Tiruchirappalli via Direct Recruitment
Event Status : Created Event
Timeline
Important Dates
Application Closing Date | 08/07/2022 |
Application Opening Date | 20/06/2022 |
Other Important Information
Appointment Type | Direct Recruitment, Research Fellowship, Examination |
Application Submission Method | Offline |
Qualification Required | Graduate, Postgraduate, Doctorate |
Total Vacancies | 1 |
Advertisement Number | NITT/R&C/P489/19-20/ISRO-RESPOND/MME/DN |
Location of Posting/Admission | Tiruchirappalli District, Tamil Nadu, India, 621006 |
Exam | GATE |
Post Type | Contractual |
Salary | 31000 |
Interview | Yes |
Work Experience | Yes |
Website | https://www.nitt.edu/ |
Place of Posting/Admission | Tiruchirappalli, Tamil Nadu, India |
Organisation Type | Educational Institution |
Note: This information is common for all posts. For details on specific posts, refer to the official notification.
Posts Released
Important Updates
Refer to the official notification for more details.
Application Summary
National Institute of Technology Tiruchirappalli invites applications for the following post via direct recruitment:
Post Name: Junior Research Fellow
Essential Qualification: BE/BTech in Metallurgy/Metallurgical Engineering/Metallurgical and Materials Engineering/ Materials Engineering/ Mechanical Engineering/ Production Engineering and ME/MTech in Metallurgy/Metallurgical Engineering/Metallurgical and Materials Engineering/ Materials Engineering/ Mechanical Engineering/ Production Engineering with valid GATE score. PhD in Metallurgical and Materials Engineering is also preferable. Prior experience in the area of metal forming is preferred.
Address to send the application: Candidate must fill in the application form and send it to Dr D Nagarajan, Department of Metallurgical and Materials Engineering, National Institute of Technology, Tiruchirappalli – 620 015, Tamil Nadu.
For more details related to eligibility criteria, fee, pattern, annexures, place of posting etc. refer to the attachments below.