Young Professional Post in Digital India Corporation via Direct Recruitment
Event Status : Created Event
Timeline
Important Dates
Application Closing Date | 25/03/2023 |
Application Opening Date | 24/02/2023 |
Other Important Information
Appointment Type | Direct Recruitment |
Application Submission Method | Online |
Age Limit | 18-32 |
Qualification Required | Postgraduate, Doctorate, CA/CMA/CS, Diploma, Graduate |
Total Vacancies | 20 |
Advertisement Number | N-22030/1/2020-NeGD |
Location of Posting/Admission | New Delhi, Delhi, India, 110011 |
Post Type | Contractual |
Place of Posting/Admission | New Delhi, Delhi, India |
Salary | 60000 |
Work Experience | Yes |
Website | https://dic.gov.in/ |
Organisation Type | Non-Educational Institution |
Application Link | https://docs.google.com/forms/d/e/1FAIpQLSfb8uziWsZYQEkBkrFQ_5GcSSkSL5NVkbdKDsQDEKN1UqI2Sw/viewform?usp=sf_link |
Note: This information is common for all posts. For details on specific posts, refer to the official notification.
Posts Released
Important Updates
Refer to the official notification for more details.
Application Summary
Digital India Corporation invites applications for the following posts via direct recruitment:
Post Name: Young Professional
Essential Qualification:
Masters Degree in Cyber Security, Cyber laws / Emerging Technologies (AI/ML, Blockchain, Cloud Computing, Quantum Computing; AR/ VR, Electronics, IOT, Drone, NLT, etc)/e-Governance/ Digital Transformations/IT /Policy Making/ Entrepreneurship or equivalent OR
BE/B. Tech or 2 Years PG Diploma in Management or LLB or CA or ICWA.
Essential Work Experience: Minimum of one (01) years experience in Government, reputed Governmental Organizations, International development agencies and Research Organizations.
Desirable: Persons with M. Phil, PhD, additional qualifications, research experience, published papers and post qualification experience in the relevant field would be preferred.
For more details related to eligibility criteria, fee, pattern, annexure, place of posting etc. refer to the attachments below.