Phd Program in SLIET for the Academic Session 2022-23
Event Status : Created Event
Timeline
Important Dates
Date of Interview | 12/01/2023 |
Application Closing Date | 10/01/2023 |
Application Opening Date | 20/12/2022 |
Other Important Information
Admission Bases | Course Admission, Fellowship |
Application Submission Method | Online |
Qualification Required | Postgraduate |
Stream | Engineering, Management, Science, Education |
Application Fee | Yes |
Location of Posting/Admission | Sangrur District, Punjab, India, 148021 |
Educational Credential Awarded | Degree |
Place of Posting/Admission | Longowal, Punjab, India |
Department/Subject | Chemical Engineering, Chemistry, Computer Science and Engineering, Electrical and Instrumentation Engineering, Electronics and Communication Engineering, Food Engineering and Technology, Humanities, Management, Mathematic, Mechanical Engineering, Physic, Central Facility Lab |
Interview | Yes |
Organisation Type | Educational Institution |
Website | https://www.slietexam.co. |
Application Link | https://www.slietexam.co.in/Login |
Note: This information is common for all posts. For details on specific posts, refer to the official notification.
Courses Released
1. Doctor of Philosophy
Important Updates
Refer to the official notification for more details.
Application Summary
Sant Longowal Institute of Engineering and Technology has released a notification for the Doctor of Philosophy program. Interested candidates can apply from 20/12/2022 to 10/01/2023. Download the official prospectus for details on eligibility, program information, admission procedure, fee structure, and more.
Sant Longowal Institute of Engineering and Technology invites online applications from eligible candidates for admission in Doctorate programme. The important details of the admission process are listed below -
Course name: Doctor of Philosophy
Educational Qualification: Post Graduate in Engineering/ Technology
For more details related to eligibility criteria, syllabus, fee, pattern, annexures, etc refer to the attachments below.