Guest Faculty Post in Tezpur University via Walk-In-Interview
Event Status : Created Event
Timeline
Important Dates
Application Opening Date | 22/08/2022, 23/08/2022, 24/08/2022, 25/08/2022, 26/08/2022, 30/08/2022 |
Application Closing Date | 22/08/2022, 23/08/2022, 24/08/2022, 25/08/2022, 26/08/2022, 29/08/2022, 30/08/2022 |
Date of Interview | 22/08/2022, 23/08/2022, 24/08/2022, 25/08/2022, 26/08/2022, 29/08/2022, 30/08/2022 |
Other Important Information
Appointment Type | Walk-In-Interview, Examination |
Application Submission Method | Online |
Qualification Required | Graduate, Postgraduate, Doctorate |
Total Vacancies | 14 |
Advertisement Number | 09/2022 |
Application Fee | Yes |
Location of Posting/Admission | Sonitpur District, Assam, India, 784025 |
Exam | CSIR NET, SLET, UGC NET, SET |
Interview | Yes |
Department/Subject | Design, Education, Physic, Applied Science, Chemical Science, Business Administration, CDOE, Sociology |
Post Type | Contractual |
Work Experience | Yes |
Organisation Type | Educational Institution |
Place of Posting/Admission | Tezpur, Assam, India |
Website | http://www.tezu.ernet.in/ |
Event Category | Education |
Salary | 50000 |
Note: This information is common for all posts. For details on specific posts, refer to the official notification.
Posts Released
Important Updates
Refer to the official notification for more details.
Application Summary
Tezpur University invites application from eligible candidates for Walk-in-Interview for the following posts:
Post Name:
Guest Faculty (Design)
Guest Faculty (Education)
Guest Faculty (Physics)
Guest Faculty (Applied Sciences)
Guest Faculty (Chemical Sciences)
Guest Faculty (Business Administration)
Guest Faculty (CDOE-Sociology)
Application can also be sent via email to hod_design@tezu.ernet. in, hod_edu@tezu.ernet.in, hod_phy@tezu.ernet.in, hod_aps@tezu.ernet.in, hod_chem@tezu.ernet.in, hod_ba@tezu.ernet.in, cdoe_director@tezu.ern et.in
For more details related to eligibility criteria, fee, pattern, annexures, place of posting etc. refer to the attachments below.