Junior Research Fellow Post in PAU via Walk-In-Interview
Event Status : Interview reschedule and Period of engagement revised
Timeline
Important Dates
Date of Interview | 22/02/2024 |
Application Closing Date | 15/02/2024 |
Application Opening Date | 26/12/2023 |
Other Important Information
Appointment Type | Walk-In-Interview, Research Fellowship |
Application Submission Method | Offline |
Qualification Required | Graduate, Postgraduate, Doctorate |
Total Vacancies | 1 |
Advertisement Number | PFE/2024/3150-59 |
Application Fee | Yes |
Location of Posting/Admission | Ludhiana District, Punjab, India, 141421 |
Exam | CSIR NET, GATE, UGC NET |
Department/Subject | Processing and Food Engineering |
Post Type | Contractual |
Interview | Yes |
Organisation Type | Educational Institution |
Website | https://www.pau.edu/ |
Place of Posting/Admission | Ludhiana, Punjab, India |
Note: This information is common for all posts. For details on specific posts, refer to the official notification.
Posts Released
Important Updates
Refer to the official notification for more details.
Application Summary
Punjab Agricultural University invites application from eligible candidates for Walk-in-Interview for the following post:
Post Name: Junior Research Fellow
Essential Qualification:
BE /B Tech/BSc with minimum OCPA of 6.00/10.00 basis or 60% marks.
M Tech in Processing and Food Engineering/Food Engineering and Technology/Post Harvest Engineering/ Food science and Technology or equivalent with minimum OCPA of 6.50/10.00 basis or 65% marks.
Must have cleared National level examination conducted by Central Government Eligibility Test like CSIR/UGC/NET/GATE/MHRD, etc.
The candidate who does not possess Masters degree in the relevant subject but possesses PhD Degree in the discipline required at Masters level, shall be eligible for the post.
Place of Interview: Office of Head, Department of Processing and Food Engineering, PAU
For more details related to eligibility criteria, fee, pattern, annexure, place of posting etc. refer to the attachments below.