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  • Senior Research Fellow Post in University of Hyderabad via Direct Recruitment

    Event Status : Created Event

Timeline

Important Dates

Application Closing Date
25/08/2022
Application Opening Date
04/08/2022

Other Important Information

Appointment Type
Direct Recruitment, Research Fellowship
Application Submission Method
Online
Qualification Required
Graduate, Postgraduate
Total Vacancies
1
Location of Posting/Admission
Hyderabad District, Telangana, India, 500028
Interview
Yes
Work Experience
Yes
Website
https://uohyd.ac.in/
Organisation Type
Educational Institution
Place of Posting/Admission
Hyderabad, Telangana, India
Salary
35000
Post Type
Contractual

Note: This information is common for all posts. For details on specific posts, refer to the official notification.

Posts Released

1. Senior Research Fellow

Important Updates

Refer to the official notification for more details.

Application Summary

University of Hyderabad has released a notification for the Senior Research Fellow post. Interested candidates can apply from 04/08/2022 to 25/08/2022. Download the official notification for details on eligibility, post information, job procedure, pay scale, and more.

University of Hyderabad invites applications for the following post via direct recruitment:

Post Name: Senior Research Fellow

Essential Qualification: B. Tech. / M. Tech. in Metallurgical Engineering /Materials Engineering/ Mechanical Enginnering with a minimum of 60% marks. For SC/ST candidates, a minimum of 55% marks is required. In case of B. Tech, candidates, a relevant experience of two years is mandatory.

Desirable:

  • experience in development and characterization of structural engineering materials

  • experience in utilizing characterization techniques such as X-ray diffusion and electron microscopy

  • experience knowledge on mechanical behaviour of materials

Application can be sent via email to kvre@uohvd.ac.in

For more details related to eligibility criteria, fee, pattern, annexures, place of posting etc. refer to the attachments below.