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  • Senior Consultant (Technical) and 5 Other Post in CIET via Walk-in-Interview

    इवेंट की स्थिति : Created Event

घटनाक्रम

महत्वपूर्ण तिथियाँ

Application Closing Date
02/06/2023
Date of Interview
30/05/2023, 31/05/2023, 01/06/2023, 02/06/2023
Application Opening Date
30/05/2023

अन्य महत्वपूर्ण जानकारी

Appointment Type
Walk-In-Interview, Examination, Research Fellowship
Application Submission Method
Offline
Qualification Required
Graduate, Postgraduate
Total Vacancies
10
Location of Posting/Admission
New Delhi, Delhi, India, 110011
Exam
CSIR NET, SLET, UGC NET
Department/Subject
Technical, Academic
Post Type
Contractual
Interview
Yes
Work Experience
Yes
Place of Posting/Admission
New Delhi, Delhi, India
Organisation Type
Non-Educational Institution
Website
https://ciet.nic.in/
Salary
60000, 45000, 30000

नोट: यह जानकारी सभी पदों के लिए सामान्य है। विशिष्ट पदों से संबंधित विवरण के लिए, कृपया आधिकारिक अधिसूचना देखें।

जारी की गई पोस्ट्स

1. Senior Consultant
2. Consultant
3. Content Developer
4. Junior Project Fellow

महत्वपूर्ण अपडेट

अधिक जानकारी के लिए आधिकारिक अधिसूचना देखें।

एप्लीकेशन सारांश

Central Institute of Educational Technology has released job notifications for 4 posts, including Senior Consultant, Consultant, and others. Interested candidates can apply from 30/05/2023 to 02/06/2023. Download the official notification for details on eligibility, post information, job procedure, pay scale, and more.

Central Institute of Educational Technology invites application from eligible candidates for Walk-in-Interview for the following posts:

Post Name:

  1. Senior Consultant (Technical)

  2. Consultant (Technical)

  3. Consultant (Academic)

  4. Content Developer (Academic)

  5. Content Developer (Technical)

  6. Junior Project Fellow

Place of Interview: Section Officer (SO), Planning & Research Division (P&RD), Room No.242, CIET 2nd floor, Chacha Nehru Bhawan, CIET, NCERT, New Delhi-110016

For more details related to eligibility criteria, fee, pattern, annexures, place of posting etc. refer to the attachments below.