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  • Research Intern-I and 2 Other Post in NIT Silchar via Direct Recruitment

    Event Status : Created Event

Timeline

Important Dates

Application Closing Date
25/01/2023
Application Opening Date
16/01/2023

Other Important Information

Appointment Type
Direct Recruitment, Examination
Application Submission Method
Online
Qualification Required
Graduate, Postgraduate, Doctorate
Total Vacancies
5
Location of Posting/Admission
Cachar District, Assam, India, 788101
Exam
GATE
Interview
Yes
Organisation Type
Educational Institution
Place of Posting/Admission
Silchar, Assam, India
Website
http://www.nits.ac.in/
Post Type
Contractual

Note: This information is common for all posts. For details on specific posts, refer to the official notification.

Posts Released

1. Research Intern-I
2. Research Intern-II
3. Research Intern-III

Important Updates

Refer to the official notification for more details.

Application Summary

National Institute of Technology Silchar has released job notifications for 3 posts, including Research Intern-I, Research Intern-II, and others. Interested candidates can apply from 16/01/2023 to 25/01/2023. Download the official notification for details on eligibility, post information, job procedure, pay scale, and more.

National Institute of Technology Silchar invites applications for the following posts via direct recruitment:

Post Name: Research Intern-I

Essential Qualification: B.E./B.Tech in Civil Engineering or other allied areas (Completed or pursuing final year) with a minimum of 7.0 CGPA or 70% in aggregate.

Post Name: Research Intern-II

Essential Qualification: M.E./M.Tech in Structural Engineering or other allied areas (Completed or pursuing) with a minimum of 7.0 CGPA or 70% in aggregate.

 

Post Name: Research Intern-III

Essential Qualification: Ph.D. in Structural Engineering or other allied areas (Pursuing)

Application send via email to subhrajit.dutta@civil.nits.ac.

For more details related to eligibility criteria, fee, pattern, annexure, place of posting etc. refer to the attachments below.