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  • Project Junior Engineer Post in IISER Bhopal via Direct Recruitment

    Event Status : Created Event

Timeline

Important Dates

Application Closing Date
05/03/2024
Application Opening Date
20/02/2024

Other Important Information

Appointment Type
Direct Recruitment
Application Submission Method
Online
Qualification Required
Graduate, Postgraduate
Total Vacancies
1
Location of Posting/Admission
Bhopal District, Madhya Pradesh, India, 322211
Work Experience
Yes
Place of Posting/Admission
Bhopal, Madhya Pradesh, India
Website
https://www.iiserb.ac.in/
Organisation Type
Educational Institution
Post Type
Contractual
Salary
37570
Interview
Yes

Note: This information is common for all posts. For details on specific posts, refer to the official notification.

Posts Released

1. Project Junior Engineer

Important Updates

Refer to the official notification for more details.

Application Summary

Indian Institute of Science Education and Research Bhopal has released a notification for the Project Junior Engineer post. Interested candidates can apply from 20/02/2024 to 05/03/2024. Download the official notification for details on eligibility, post information, job procedure, pay scale, and more.

Indian Institute of Science Education and Research Bhopal invites applications for the following posts via direct recruitment:

Post Name:Project Junior Engineer

Essential Qualification: B.E./B. Tech (CS/IT/EE,EC) /MCA/M.Sc.(CS/IT) or equivalent

Essential Work Experience:

  • 1-2 years hands-on experience in the following area.

  • Programming skills in PHP, Codelgniter, HTML, CSS JavaScript, and jQuery, MySQL

  • Knowledge of Drupal framework, CMS, and custom Drupal modules.

  • Knowledge of PHP, PHP files and theme functions, and knowledge of the Drupal theme layer.

  • Experience building user interfaces for websites and/or web applications.

Application can also be sent via email to office.gadmp@gmail.com

For more details related to eligibility criteria, fee, pattern, annexure, place of posting etc. refer to the attachments below.