Exam Path Finder
Select Item
organisation_logo
  • Research Project Intern Post in IIITDM Kancheepuram via Direct Recruitment

    Event Status : Created Event

Timeline

Important Dates

Application Closing Date
20/12/2022
Application Opening Date
09/12/2022

Other Important Information

Appointment Type
Direct Recruitment
Application Submission Method
Online
Age Limit
16-19
Qualification Required
Graduate
Total Vacancies
2
Advertisement Number
IIITDMK/PR/INTERNS/A31/2022
Location of Posting/Admission
Tamil Nadu, India, 641602
Place of Posting/Admission
Kancheepuram, Tamil Nadu, India
Organisation Type
Educational Institution
Website
https://www.iiitdm.ac.in/
Post Type
Contractual
Interview
Yes
Salary
5000
Application Link
https://www.iiitdm.ac.in/

Note: This information is common for all posts. For details on specific posts, refer to the official notification.

Posts Released

1. Research Project Intern

Important Updates

Refer to the official notification for more details.

Application Summary

Indian Institute of Information Technology Design and Manufacturing Kancheepuram has released a notification for the Research Project Intern post. Interested candidates can apply from 09/12/2022 to 20/12/2022. Download the official notification for details on eligibility, post information, job procedure, pay scale, and more.

Indian Institute of Information Technology Design and Manufacturing Kancheepuram invites applications for the following post via direct recruitment:

Post Name : Research Project Intern

Essential Qualification : 2nd year students of BTech or Dual Degree in CSE/ECE/Mechanical Engineering or Smart Manufacturing or any other equivalent. Candidate is expected to be well versed with programing skills for Arduino board, IOT applications etc.

Place of Interview: Indian Institute of Information Technology Design and Manufacturing, Kancheepuram Melakkottaiyur, Off Vandalur-Kelambakkam Road, Chennai-600127.

For more details related to eligibility criteria, fee, pattern, annexures, place of posting etc. refer to the attachments below.