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  • Chief Ship Surveyor-cum Joint Director General (Technical) post in Directorate General Shipping Mumbai via Deputation

    Event Status : Created Event

Important Dates

Application Closing Date
05/05/2022
Application Opening Date
07/03/2022

Other Important Information

Appointment Type
Deputation, Promotion
Application Submission Method
Offline
Age Limit
18-56
Qualification Required
Graduate
Total Vacancies
1
Advertisement Number
A-32012/1/2020-MA (e-file No.-341013)
Location of Posting/Admission
Maharashtra, India, 421302
Organisation Type
Non-Educational Institution
Website
https://www.dgshipping.gov.in/
Place of Posting/Admission
Maharashtra, India
Post Type
Contractual
Work Experience
Yes
Pay Matrix
Level 14, Grade Pay 10000
Salary
247866
Group
Group A
Department/Subject
Technical

Note: This information is common for all posts. For details on specific posts, refer to the official notification.

Posts Released

1. Chief Ship Surveyor-cum Joint Director General

Important Updates

Refer to the official notification for more details.

Application Summary

Directorate General of Shipping Mumbai has released a notification for the Chief Ship Surveyor-cum Joint Director General post. Interested candidates can apply from 07/03/2022 to 05/05/2022. Download the official notification for details on eligibility, post information, job procedure, pay scale, and more.

Directorate General Shipping Mumbai invites applications for the following post via Deputation

Post Name: Chief Ship Surveyor-cum Joint Director General (Technical)

Essential Qualification: Degree in Naval Architecture from a recognized university or equivalent.

Essential Work Experience: 15 years experience in design, Construction and repair of ships

Address to send the application: Candidate must fill in the application form and send it to The Ministry of Ports, Shipping and Waterways, Transport Bhavan, 1, Parliament Street, New Delhi-110001

For more details related to eligibility criteria, fee, pattern, annexures, place of posting etc. refer to the attachments below.