Junior Technician Post in IIT BHU via Direct Recruitment
Event Status : Result Declared
Timeline
Important Dates
Result Available | 28/10/2023 |
Exam Date | 28/10/2023 |
Application Closing Date | 05/10/2023 |
Application Opening Date | 15/09/2023 |
Other Important Information
Appointment Type | Direct Recruitment |
Application Submission Method | Online |
Age Limit | 18-27 |
Qualification Required | Graduate, Diploma |
Total Vacancies | 27 |
Advertisement Number | 02/2023-24 |
Application Fee | Yes |
Location of Posting/Admission | Varanasi District, Uttar Pradesh, India, 221003 |
Age Relaxation Type | SC/ST, Other Backward Class |
Quota/Reservation | Scheduled Castes, Scheduled Tribes, Unreserved, Other Backward Classes, Economically Weaker Sections |
Interview | Yes |
Work Experience | Yes |
Organisation Type | Educational Institution |
Place of Posting/Admission | Varanasi, Uttar Pradesh, India |
Group | Group C |
Post Code | 23131, 23132, 23133, 23134, 23135 |
Website | https://iitbhu.ac.in/ |
Application Link | https://iitbhu.ac.in/ |
Note: This information is common for all posts. For details on specific posts, refer to the official notification.
Posts Released
Important Updates
Refer to the official notification for more details.
Application Summary
Indian Institute of Technology BHU invites applications for the following posts via direct recruitment:
Post Name: Junior Technician
Essential Qualification:
1. Bachelors Degree in Engineering in the mentioned branch under the given group with a minimum of 55% marks in the qualifying degree from a recognized University / Institute. OR
Three years Diploma in Engineering in the mentioned branch under the given group (after 10+2) with a minimum of 55% marks from a recognized University / Institute with one-year relevant experience.
2. Proficiency in the use of a variety of computer office applications, M.S. Word, Excel, Power Point or equivalent is a must.
For more details related to eligibility criteria, fee, pattern, annexure, place of posting etc. refer to the attachments below.