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  • Scientist F/E Post in Technology Development Board via Deputation/Absorption

    Event Status : Created Event

Important Dates

Application Closing Date
13/05/2022
Application Opening Date
02/04/2022

Other Important Information

Appointment Type
Deputation, Absorption
Application Submission Method
Offline
Age Limit
18-56
Qualification Required
Postgraduate
Total Vacancies
1
Advertisement Number
TDB/47/2021- Admin
Location of Posting/Admission
New Delhi, Delhi, India, 110011
Website
http://tdb.gov.in/
Organisation Type
Non-Educational Institution
Place of Posting/Admission
New Delhi, Delhi, India
Post Type
Contractual
Work Experience
Yes
Pay Matrix
Level 13A, Grade Pay 8900, Level 13, Grade Pay 8700
Salary
226251, 213051

Note: This information is common for all posts. For details on specific posts, refer to the official notification.

Posts Released

1. Scientist-F
2. Scientist-E

Important Updates

Refer to the official notification for more details.

Application Summary

Technology Development Board has released notifications for the Scientist-F and Scientist-E posts. Interested candidates can apply from 02/04/2022 to 13/05/2022. Download the official notification for details on eligibility, post information, job procedure, pay scale, and more.

Technology Development Board invites applications for the following posts via Deputation/Absorption:

Post Name: Scientist F / Scientist E

Essential Qualification: Post- Graduation in Science or M.Tech in Engineering or technology related subject.

Essential Work Experience: Three years experience in responsible position on technology financing / technology commercialization.

Address where Application is to be sent: Candidate must ensure to fill in their applications and send it to Under Secretary, Technology Development Board, Department of Science & Technology, Block II, Second Floor, Technology Bhawan, New Delhi - 110016 along with the relevant documents.

For more details related to eligibility criteria, fee, pattern, annexures, place of posting, etc refer to the attachments below.