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  • Junior Research Fellow Post in NIT Jalandhar via Direct Recruitment

    Event Status : Created Event

Timeline

Important Dates

Application Closing Date
10/04/2024
Application Opening Date
11/03/2024

Other Important Information

Appointment Type
Direct Recruitment, Research Fellowship
Application Submission Method
Online
Qualification Required
Postgraduate
Total Vacancies
1
Location of Posting/Admission
Jalandhar District, Punjab, India, 144001
Exam
GATE
Work Experience
Yes
Organisation Type
Educational Institution
Place of Posting/Admission
Jalandhar, Punjab, India
Website
https://www.nitj.ac.in/
Post Type
Contractual
Interview
Yes
Salary
31000

Note: This information is common for all posts. For details on specific posts, refer to the official notification.

Posts Released

1. Junior Research Fellow

Important Updates

Refer to the official notification for more details.

Application Summary

Dr B R Ambedkar National Institute of Technology Jalandhar has released a notification for the Junior Research Fellow post. Interested candidates can apply from 11/03/2024 to 10/04/2024. Download the official notification for details on eligibility, post information, job procedure, pay scale, and more.

Dr B R Ambedkar National Institute of Technology Jalandhar invites applications for the following posts via direct recruitment:

Post Name:Junior Research Fellow

Essential Qualification: Post graduate degree in basic science (Physics and chemistry) with NET qualification or Graduate in Textile Technology/ Textile Engineering with GATE or M.Tech in Textiles/ Polymer/ Fiber Science/Chemical Engineering / Material Science/Chemistry/Physics/Mechanical/Paper and Pulp/Nanotechnology/relevant branches.

Desirable: Knowledge about textile machines and mechanisms, weave designs, weaving machine design, high performance yarns such as glass, carbon, fibre reinforced composites.

Application send via email to kamblezb@nitj.ac.in

For more details related to eligibility criteria, fee, pattern, annexure, place of posting etc. refer to the attachments below.