Project Associate-I and 3 Other Post in CSIR AMPRI via Direct Recruitment
Event Status : Result Declared
Timeline
Important Dates
Result Available | 28/11/2023 |
Date of Interview | 20/11/2023, 21/11/2023, 22/11/2023 |
Application Closing Date | 11/10/2023 |
Application Opening Date | 21/09/2023 |
Other Important Information
Appointment Type | Direct Recruitment |
Application Submission Method | Online |
Age Limit | 18-50 |
Qualification Required | Postgraduate, Graduate, Diploma |
Total Vacancies | 14 |
Advertisement Number | PROJ-4/2023 |
Location of Posting/Admission | Bhopal District, Madhya Pradesh, India, 322211 |
Exam | CSIR NET, GATE, UGC NET |
Post Type | Contractual |
Salary | 31000, 25000, 20000, 35000, 28000, 42000 |
Age Relaxation Type | SC/ST, Other Backward Class, Person with Benchmark Disabilities, Woman |
Interview | Yes |
Work Experience | Yes |
Place of Posting/Admission | Bhopal, Madhya Pradesh, India |
Website | https://ampri.res.in/ |
Organisation Type | Non-Educational Institution |
Application Link | https://ampri.res.in/ |
Note: This information is common for all posts. For details on specific posts, refer to the official notification.
Posts Released
1. Project Associate-I
2. Project Assistant
3. Project Associate-II
4. Senior Project Associate
Important Updates
Refer to the official notification for more details.
Application Summary
CSIR Advanced Materials And Process Research Institute has released job notifications for 4 posts, including Project Associate-I, Project Assistant, and others. Interested candidates can apply from 21/09/2023 to 11/10/2023. Download the official notification for details on eligibility, post information, job procedure, pay scale, and more.
CSIR Advanced Materials And Process Research Institute invites applications for the following posts via direct recruitment:
Post Name:
Project Associate-I
Project Assistant
Project Associate-II
Senior Project Associate
For more details related to eligibility criteria, fee, pattern, annexure, place of posting etc. refer to the attachments below.