Post Doctoral Fellow (Nanotechnology) and 3 Other Post in Kerala University of Digital Sciences Innovation and Technology via Direct Recruitment
Event Status : Created Event
Timeline
Important Dates
Application Closing Date | 20/10/2022 |
Application Opening Date | 03/10/2022 |
Other Important Information
Appointment Type | Direct Recruitment, Research Fellowship |
Application Submission Method | Online |
Age Limit | 18-40 |
Qualification Required | Doctorate, Postgraduate |
Total Vacancies | 11 |
Advertisement Number | KUDSIT/719/ AR AD /2022 |
Application Fee | Yes |
Location of Posting/Admission | Thiruvananthapuram District, Kerala, India, 695572 |
Website | https://duk.ac.in/ |
Organisation Type | Educational Institution |
Post Type | Contractual |
Department/Subject | NanoTechnology, Electronics System Design |
Age Relaxation Type | SC/ST, Other Backward Class |
Work Experience | Yes |
Place of Posting/Admission | Thiruvananthapuram, Kerala, India |
Interview | Yes |
Salary | 49000, 45000, 25000 |
Note: This information is common for all posts. For details on specific posts, refer to the official notification.
Posts Released
1. Postdoctoral Fellow
2. Research Engineer
3. Research Associate
Important Updates
Refer to the official notification for more details.
Application Summary
Kerala University of Digital Sciences Innovation and Technology has released job notifications for 3 posts, including Postdoctoral Fellow, Research Engineer, and others. Interested candidates can apply from 03/10/2022 to 20/10/2022. Download the official notification for details on eligibility, post information, job procedure, pay scale, and more.
Kerala University of Digital Sciences Innovation and Technology invites applications for the following posts via direct recruitment:
Post Name :
(1) Post Doctoral Fellow (Nanotechnology)
(2) Post Doctoral Fellow (Electronics System Design)
(3) Research Engineer
(4) Research Associate
For more details related to eligibility criteria, fee, pattern, annexures, place of posting etc. refer to the attachments below.