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  • IT Incharge Post in IRCON via Direct Recruitment

    Event Status : Created Event

Timeline

Important Dates

Application Closing Date
06/11/2023
Application Opening Date
10/10/2023

Other Important Information

Appointment Type
Direct Recruitment
Application Submission Method
Offline
Age Limit
18-35
Qualification Required
Graduate
Total Vacancies
4
Advertisement Number
C-16/2023
Location of Posting/Admission
New Delhi, Delhi, India, 110011
Age Relaxation Type
SC/ST, Other Backward Class, Person with Benchmark Disabilities
Quota/Reservation
Unreserved, Other Backward Classes
Work Experience
Yes
Organisation Type
Non-Educational Institution
Website
https://www.irconisl.com/
Place of Posting/Admission
New Delhi, Delhi, India
Post Type
Contractual
Salary
36000

Note: This information is common for all posts. For details on specific posts, refer to the official notification.

Posts Released

1. Information technology Incharge

Important Updates

Refer to the official notification for more details.

Application Summary

Ircon Infrastructure and Services Limited has released a notification for the Information technology Incharge post. Interested candidates can apply from 10/10/2023 to 06/11/2023. Download the official notification for details on eligibility, post information, job procedure, pay scale, and more.

Ircon Infrastructure and Services Limited invites applications for the following posts via direct recruitment:

Post Name: IT Incharge

Essential Qualification: Graduate Engineering Degree in IT/Computer Science with not less than 60% from recognized University/Institution

Essential Work Experience:Minimum three years of experience in handling IT related works/MIS reports/SCADA systems etc.

Address to send the application: The Candidate must fill in the application form and send it to JGM/HRM, Ircon International Ltd., C-4, District Centre, Saket, New Delhi - 110017 along with relevant documents.

For more details related to eligibility criteria, fee, pattern, annexure, place of posting etc. refer to the attachments below.