
Advisor and 1 Other Post in NIEPA via Walk-In-Interview
Event Status : Created Event
Timeline
Important Dates
Date of Interview | 14/04/2024, 15/04/2024 |
Application Closing Date | 10/04/2024 |
Application Opening Date | 02/04/2024 |
Other Important Information
Appointment Type | Walk-In-Interview |
Application Submission Method | Online |
Qualification Required | Postgraduate, Doctorate |
Total Vacancies | 5 |
Advertisement Number | 25-1/2024-Rectt(teaching-contractual)/3 |
Location of Posting/Admission | New Delhi, Delhi, India, 110011 |
Post Type | Contractual |
Interview | Yes |
Work Experience | Yes |
Organisation Type | Non-Educational Institution |
Website | http://www.niepa.ac.in/ |
Place of Posting/Admission | New Delhi, Delhi, India |
Note: This information is common for all posts. For details on specific posts, refer to the official notification.
Posts Released
Important Updates
Refer to the official notification for more details.
Application Summary
National Institute of Educational Planning and Administration invites application from eligible candidates for Walk-in-Interview for the following posts:
Post Name: Advisor
Essential Qualification: Masters Degree in Social Sciences with a minimum of 55% marks
Essential Work Experience:
Research experience in International Relations
6 to 8 years experience in working with international relations.
Desirable: A Doctoral Degree in Social Sciences or International agencies
Post Name: Deputy Advisor
Essential Qualification: Masters Degree in Social Sciences with a minimum of 55% marks
Essential Work Experience:
Research experience in International Relations
2 to 3 years experience in working with international agencies
Desirable: A Doctoral Degree in Social Sciences or International relations
Place of Interview: Section Officer (Estt) in Room No-10, NIEPA, 17-B, Sri Aurobindo Marg, New Delhi-110016
Application send via email to recruitment.uic@niepa.ac.in
For more details related to eligibility criteria, fee, pattern, annexures, place of posting etc. refer to the attachments below.