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  • Adhoc Faculty Post in NIT Rourkela via Walk-in-Interview

    Event Status : Created Event

Timeline

Important Dates

Date of Interview
20/07/2023
Application Closing Date
13/07/2023
Application Opening Date
10/07/2023

Other Important Information

Appointment Type
Walk-In-Interview
Application Submission Method
Online
Qualification Required
Graduate, Postgraduate, Doctorate
Total Vacancies
1
Advertisement Number
NITR/ES/2023/ADHOC FACULTY/L/1707
Location of Posting/Admission
Sundargarh District, Odisha, India, 770037
Salary
70900, 57700
Department/Subject
Electronics and Communication Engineering
Post Type
Contractual
Interview
Yes
Place of Posting/Admission
Rourkela, Odisha, India
Organisation Type
Non-Educational Institution
Website
https://www.nitrkl.ac.in/

Note: This information is common for all posts. For details on specific posts, refer to the official notification.

Posts Released

1. Adhoc Faculty

Important Updates

Refer to the official notification for more details.

Application Summary

National Institute of Technology Rourkela has released a notification for the Adhoc Faculty post. Interested candidates can apply from 10/07/2023 to 13/07/2023. Download the official notification for details on eligibility, post information, job procedure, pay scale, and more.

National Institute of Technology Rourkela invites application from eligible candidates for Walk-in-Interview for the following posts:

Post Name: Adhoc Faculty (Electronics & Communication Engineering)

Essential Qualification: B.Tech./B.E. with M.Tech./M.E. or Ph.D.with 60% marks or 6.5 CGPA from an Indian University or an equivalent degree from an accredited foreign university with previous teaching experience at a similar level to be given preference. Candidates with Ph.D. or without Ph.D. are encouraged to attend the walk-in interview.

Place of Interview: Board Room NIT Rourkela

Application send via email to hod-ec@nitrkl.ac.in

For more details related to eligibility criteria, fee, pattern, annexures, place of posting etc. refer to the attachments below.