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  • Research Assistant Post in Indian Institute of Technology BHU via Direct Recruitment

    Event Status : Created Event

Timeline

Important Dates

Application Closing Date
11/10/2022
Application Opening Date
28/09/2022

Other Important Information

Appointment Type
Direct Recruitment
Application Submission Method
Composite
Age Limit
18-27
Qualification Required
Graduate, Postgraduate
Total Vacancies
1
Location of Posting/Admission
Varanasi District, Uttar Pradesh, India, 221003
Organisation Type
Educational Institution
Website
www.iitbhu.ac.in
Post Type
Contractual
Work Experience
Yes
Place of Posting/Admission
Varanasi, Uttar Pradesh, India
Interview
Yes
Salary
22000

Note: This information is common for all posts. For details on specific posts, refer to the official notification.

Posts Released

1. Research Assistant

Important Updates

Refer to the official notification for more details.

Application Summary

Indian Institute of Technology BHU has released a notification for the Research Assistant post. Interested candidates can apply from 28/09/2022 to 11/10/2022. Download the official notification for details on eligibility, post information, job procedure, pay scale, and more.

Indian Institute of Technology BHU invites applications for the following post via direct recruitment:

Post Name : Research Assistant

Essential Qualification : B.E. B.Tech./M.E., M.Tech. in Ceramic/Materials Engineering, Biomedical, Biochemical, Pharmaceutical or any other relevant (to project) branch with first division of marks and the applicant must be resident of Uttar Pradesh.

Desirable Work Experience : Expertise in cell culture techniques.

Address to send the application: Candidate must fill in the application form and send it to Dr Ashutosh Kumar Dubey Department of Ceramic Engineering Indian Institute of Technology (BHU) Varanasi - 221005 (U.P.)

Application can also be sent via email to akdubey.cer@iitbhu.ac.in

For more details related to eligibility criteria, fee, pattern, annexures, place of posting etc. refer to the attachments below.