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  • Junior Research Fellow Post in University of Hyderabad via Direct Recruitment

    Event Status : Created Event

Timeline

Important Dates

Application Closing Date
14/11/2023
Application Opening Date
31/10/2023

Other Important Information

Appointment Type
Direct Recruitment
Application Submission Method
Offline
Age Limit
18-27
Qualification Required
Postgraduate
Total Vacancies
1
Advertisement Number
UH/YS/SERB/01-2023
Location of Posting/Admission
Hyderabad District, Telangana, India, 500028
Exam
CSIR NET, GATE, UGC NET
Website
https://uohyd.ac.in/
Place of Posting/Admission
Hyderabad, Telangana, India
Organisation Type
Educational Institution
Post Type
Contractual
Age Relaxation Type
SC/ST, Other Backward Class
Work Experience
Yes
Interview
Yes
Salary
31000

Note: This information is common for all posts. For details on specific posts, refer to the official notification.

Posts Released

1. Junior Research Fellow

Important Updates

Refer to the official notification for more details.

Application Summary

University of Hyderabad has released a notification for the Junior Research Fellow post. Interested candidates can apply from 31/10/2023 to 14/11/2023. Download the official notification for details on eligibility, post information, job procedure, pay scale, and more.

University of Hyderabad invites applications for the following posts via direct recruitment :

Post Name : Junior Research Fellow

Essential Qualification : M.Sc., in Life Sciences with first class marks. GATE/CSIR/UGC-NET is mandatory.

Essential Work Experience : At least 6 months of lab experience in Plant research

Desirable : Preferably M.Sc. in Plant Sciences

Address to send the application: The Candidate must fill in the application form and send it to Prof. Y. Sreenivasulu, Project Investigator F-45; Department of Plant Sciences, School of Life Sciences, University of Hyderabad, Hyderabad-500046 along with relevant documents.

For more details related to eligibility criteria, fee, pattern, annexure, place of posting etc. refer to the attachments below.