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  • Research Associate Post in Indian Institute of Technology Hyderabad via Direct Recruitment

    Event Status : Created Event

Timeline

Important Dates

Application Closing Date
30/06/2022
Application Opening Date
15/06/2022

Other Important Information

Appointment Type
Direct Recruitment
Application Submission Method
Online
Qualification Required
Postgraduate, Graduate
Total Vacancies
1
Location of Posting/Admission
Hyderabad District, Telangana, India, 500028
Place of Posting/Admission
Hyderabad, Telangana, India
Website
https://iith.ac.in/
Organisation Type
Educational Institution
Salary
100000
Interview
Yes
Post Type
Contractual

Note: This information is common for all posts. For details on specific posts, refer to the official notification.

Posts Released

1. Research Associate

Important Updates

Refer to the official notification for more details.

Application Summary

Indian Institute of Technology Hyderabad has released a notification for the Research Associate post. Interested candidates can apply from 15/06/2022 to 30/06/2022. Download the official notification for details on eligibility, post information, job procedure, pay scale, and more.

Indian Institute of Technology Hyderabad invites applications for the following post via direct recruitment:

Post Name: Research Associate

Essential Qualification:

  • Bachelor’s or Master’s degree in CSE (or related departments) from reputed institutes like IISc, IITs etc.

  • Thorough understanding of basic engineering mathematics subjects like Probability and Statistics, Linear Algebra, Multivariate Calculus.

  • Good knowledge of Machine Learning and Deep Learning fundamentals.

  • Efficient programming skills (Python, C++ etc.).


Desirable :

  • Proficiency in pytorch, Matlab or other ML toolkits.

  • Numerical optimization (SGD etc.).

  • Publications in premier ML avenues

Application can be sent via email to saketha@cse.iith.ac.in

For more details related to eligibility criteria, fee, pattern, annexures, place of posting etc. refer to the attachments below.