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  • Doctorate Fellow Post in Indian Institute of Engineering Science and Technology Shibpur via Walk-In-Interview

    Event Status : Interview Postponed

Timeline

Important Dates

Date of Interview
11/08/2022
Application Opening Date
08/08/2022
Application Closing Date
08/08/2022

Other Important Information

Appointment Type
Walk-In-Interview, Research Fellowship
Application Submission Method
Online, Offline
Qualification Required
Graduate, Postgraduate, Doctorate
Total Vacancies
1
Advertisement Number
CE 1772
Location of Posting/Admission
Howrah District, West Bengal, India, 711401
Organisation Type
Educational Institution
Website
https://www.iiests.ac.in/
Place of Posting/Admission
Howrah, West Bengal, India
Department/Subject
Civil Engineering
Post Type
Contractual
Interview
Yes
Salary
40000

Note: This information is common for all posts. For details on specific posts, refer to the official notification.

Posts Released

1. Doctorate Fellow

Important Updates

Refer to the official notification for more details.

Application Summary

Indian Institute of Engineering Science and Technology Shibpur has released a notification for the Doctorate Fellow post. Interested candidates can apply from 08/08/2022 to 08/08/2022. Download the official notification for details on eligibility, post information, job procedure, pay scale, and more.

Indian Institute of Engineering Science and Technology Shibpur invites application from eligible candidates for Walk-in-Interview for the following posts:

Post Name: Doctorate Fellow

Essential Qualification: B.Tech, M.E./ M.Tech and PhD in Civil Engineering, with through knowledge in FRP composite structure, Ansys software, Finite Element Modelling and execution of experiment on dynamic behavior of model FRP structures.

Place of Interview: Office of the Head of Department of Civil Engineering, IIEST, Shibpur.

Application should be sent via email to chaitali@civil.iiests.ac.in


For more details related to eligibility criteria, fee, pattern, annexures, place of posting etc. refer to the attachments below.