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  • Technical Advisor (Engg.) Post Exam via Direct Recruitment Conducted by HPSC

    Event Status : Created Event

Timeline

Important Dates

Application Closing Date
20/02/2023
Application Opening Date
30/01/2023

Other Important Information

Appointment Type
Direct Recruitment, Examination
Application Submission Method
Online
Examination Mode
Offline
Qualification Required
Graduate, Postgraduate
Total Vacancies
1
Advertisement Number
06/2023
Application Fee
Yes
Location of Posting/Admission
Panchkula District, Haryana, India, 134205
Exam
HPSC Technical Advisor Engg Group A
Work Experience
Yes
Website
http://hpsc.gov.in/en-us/
Place of Posting/Admission
Panchkula, Haryana, India
Organisation Type
Non-Educational Institution
Group
Group A
Pay Matrix
Level 12, Grade Pay 7600
Salary
139956
Examination Centre
Regional
Event Category
State PSCs, Engineering
Department/Subject
Engineering
Interview
Yes
Application Link
https://apply.registernow.in/HPSC/TechAdvisorEngg/

Note: This information is common for all posts. For details on specific posts, refer to the official notification.

Posts Released

1. Technical Advisor

Important Updates

Refer to the official notification for more details.

Application Summary

Haryana Public Service Commission has released a notification for the Technical Advisor post. Interested candidates can apply from 30/01/2023 to 20/02/2023. Download the official notification for details on eligibility, post information, job procedure, pay scale, and more.

Haryana Public Service Commission invites applications for the following post via direct recruitment:

Post Name: Technical Advisor (Engg.)

Essential Qualification:

1. Graduate/Post graduate Degree in Mechanical Engineering with st division preferably with Boiler Operation Engineering Certificate.

2. Hindi/Sanskit up to Matric standard or higher Examination.

Essential Work Experience: At least 7 years experience in Sugar Industry as Chief Engineer. preference will be given to 2nd class ANSI

For more details related to eligibility criteria, fee, pattern, annexures, place of posting etc. refer to the attachments below.