Assistant Professor Post in GGSIU via Direct Recruitment
Event Status : Document Verification Schedule Released for Assistant Professor
Timeline
Important Dates
Application Closing Date | 30/11/2022 |
Application Opening Date | 04/11/2022 |
Other Important Information
Appointment Type | Direct Recruitment |
Application Submission Method | Offline |
Qualification Required | Graduate, Postgraduate, Doctorate, Diploma |
Total Vacancies | 16 |
Advertisement Number | IPU/East Campus/Faculty/4(36)/2022/756 |
Application Fee | Yes |
Location of Posting/Admission | New Delhi, Delhi, India, 110011 |
Exam | CSIR NET, SLET, UGC NET |
Place of Posting/Admission | New Delhi, Delhi, India |
Website | http://www.ipu.ac.in/ |
Organisation Type | Educational Institution |
Post Type | Contractual |
Department/Subject | Computer Science and Engineering, Information Technology, Artificial Intelligence, Data Science, Machine Learning, Automation and Robotics, Mechanical Engineering, Electrical Engineering, Chemistry, Mathematic, Physic, English, Design, Product Design, Manufacturing Design and allied Areas |
Work Experience | Yes |
Interview | Yes |
Quota/Reservation | Unreserved, Scheduled Castes, Scheduled Tribes, Other Backward Classes, PWBD Quota |
Pay Matrix | Level 10, Grade Pay 5400 |
Salary | 102501 |
Note: This information is common for all posts. For details on specific posts, refer to the official notification.
Posts Released
Important Updates
Refer to the official notification for more details.
Application Summary
Guru Gobind Singh Indraprastha University invites applications for the following posts via direct recruitment :
Post Name : Assistant Professor
Address to send the application: The Candidate must fill in the application form and send it to Deputy Registrar (Personnel), Room No. 021, Administrative Block, Guru Gobind Singh Indraprastha University, Sector 16-C, Dwarka, New Delhi-110078 along with relevant documents.
For more details related to eligibility criteria, fee, pattern, annexure, place of posting etc. refer to the attachments below.