Exam Path Finder
Select Item
organisation_logo
  • Diploma in Tool And Mould Making (DTDM) and other course in Central Institute of Tool Design

    Event Status : Created Event

Timeline

Important Dates

Application Closing Date
02/05/2020
Application Opening Date
02/03/2020

Other Important Information

Admission Bases
Diploma Course
Application Submission Method
Online
Qualification Required
Matriculate
Stream
Engineering
Application Fee
Yes
Location of Posting/Admission
Hyderabad District, Telangana, India, 500028
Organisation Type
Educational Institution
Place of Posting/Admission
Hyderabad, Telangana, India
Age Limit
15-19
Age Relaxation Type
SC/ST
Website
www.citdindia.org

Note: This information is common for all posts. For details on specific posts, refer to the official notification.

Courses Released

1. Diploma in Tool, Die And Mould Making (DTDM)
2. Diploma in Electronics And Communication Engineering (DECE)
3. Diploma in Automation and Robotics Engineering
4. Diploma in Production Engineering (DPE)

Important Updates

Refer to the official notification for more details.

Application Summary

Central Institute of Tool Design Hyderabad has released admission notifications for 4 programs, including Diploma in Tool, Die And Mould Making (DTDM), Diploma in Electronics And Communication Engineering (DECE), and others. Interested candidates can apply from 02/03/2020 to 02/05/2020. Download the official prospectus for details on eligibility, program information, admission procedure, fee structure, and more.

Central Institute of tool design invites online application from eligible candidates for

admission in the Diploma programme. The important details of the admission process are listed below -


Course name:

Diploma in Tool, Die And Mould Making (DTDM)

Diploma in Electronics And Communication Engineering (DECE)

Diploma in Automation And Robotics Engineering (DARE)

Diploma in Production Engineering (DPE)


For more details related to eligibility criteria, syllabus, fee, pattern, annexures etc refer to the attachments below.