Senior Project Engineer Post in India Education and Research Network via Walk in Interview
Event Status : Created Event
Timeline
Important Dates
Application Opening Date | 20/06/2022 |
Application Closing Date | 20/06/2022 |
Date of Interview | 20/06/2022 |
Other Important Information
Appointment Type | Walk-In-Interview, Examination |
Application Submission Method | Offline |
Examination Mode | Offline |
Age Limit | 18-45 |
Qualification Required | Graduate, Postgraduate |
Total Vacancies | 4 |
Location of Posting/Admission | New Delhi, Delhi, India, 110011 |
Exam | ERNET Senior Project Engineer |
Website | https://ernet.in/ |
Organisation Type | Educational Institution |
Post Type | Contractual |
Interview | Yes |
Work Experience | Yes |
Place of Posting/Admission | New Delhi, Delhi, India |
Salary | 60000 |
Age Relaxation Type | SC/ST, Other Backward Class, Economically Weaker Section |
Examination Centre | Regional |
Note: This information is common for all posts. For details on specific posts, refer to the official notification.
Posts Released
Important Updates
Refer to the official notification for more details.
Application Summary
India Education and Research Network invites application from eligible candidates for Walk-in-Interview for the following post :
Post Name : Senior Project Engineer
Essential Qualification : Full time B.Tech/BE/MCA/M.Sc or equivalent degree in Electronics/Information Technology/Electronics and Communication/Tele Communication/Computer Science/Computer application/Instrumentation/Physics/Project Management/Quantum Communication.
Essential Work Experience : Atleast 04 years in the above relevant field post qualification in case of B.Tech/BE/MCA/MSc or equivalent or Minimum 02 year of experience in the above relevant field post qualification in case of M.Tech/ME or equivalent.
Place of Interview : 5th Floor, Block I, A Wing, DMRC Building, IT Park, Shastri Park, Delhi-110053
For more details related to eligibility criteria, fee, pattern, annexures, place of posting etc. refer to the attachments below.