Project Associate-I Post in Institute of Himalayan Bioresource Technology Palampur via Direct Recruitment
Event Status : Result Declared
Timeline
Important Dates
Result Available | 31/05/2022 |
Date of Interview | 02/05/2022, 04/05/2022 |
Application Closing Date | 12/03/2022 |
Application Opening Date | 09/03/2022 |
Other Important Information
Appointment Type | Direct Recruitment, Examination |
Application Submission Method | Online |
Age Limit | 18-35 |
Qualification Required | Postgraduate, Graduate |
Total Vacancies | 5 |
Advertisement Number | 03/2022 |
Location of Posting/Admission | Kangra District, Himachal Pradesh, India, 176056 |
Exam | CSIR NET, GATE, UGC NET |
Website | https://www.ihbt.res.in/ |
Organisation Type | Educational Institution |
Post Type | Contractual |
Post Code | 3001, 3002, 3003 |
Work Experience | Yes |
Place of Posting/Admission | Palampur, Himachal Pradesh, India |
Interview | Yes |
Salary | 31000 |
Note: This information is common for all posts. For details on specific posts, refer to the official notification.
Posts Released
Important Updates
Refer to the official notification for more details.
Application Summary
Institute of Himalayan Bioresource Technology Palampur invites applications for the following post via direct recruitment:
Post Name : Project Associate-I
Essential Qualification :
(1) Master Degree in Plant Breeding and Genetics/Botany/Plant Sciences/ biotechnology/ Molecular Biology/ Bioinformatics from recognized university
(2) B.Tech Chemical Engineering/Polymer engineer. M.Sc Industrial Chemistry Technology/Textile Engineer.
Essential Work Experience :
(1) At least one year research experience in R and D industrialized academic institution or science and Technology organisation
(2) work experience in NGS/genome wide molecular markers/ High throughput Genotyping/ Molecular mapping.
Application can be sent via email to ramsharma@ihbt.res.in and mohit@ihbt.res.in.
For more details related to eligibility criteria, fee, pattern, annexures, place of posting etc. refer to the attachments below.