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  • ADTDM and 1 Other Programme in MSME Technology Centre Bhiwadi For Academic Year 2023-24

    Event Status : Created Event

Timeline

Important Dates

Application Opening Date
15/05/2023, 26/06/2023
Exam Date
30/07/2023

Other Important Information

Admission Bases
Diploma Course
Application Submission Method
Online
Examination Mode
Offline
Qualification Required
Matriculate
Stream
Science, Engineering
Application Fee
Yes
Location of Posting/Admission
Kherthal-Tijara District, Rajasthan, India, 301411
Exam
MSME TC Bhiwadi Entrance Examination
Educational Credential Awarded
Diploma
Place of Posting/Admission
Bhiwadi, Rajasthan, India
Organisation Type
Non-Educational Institution
Website
https://www.msmetcbhiwadi.org/
Age Limit
16-19
Age Relaxation Type
SC/ST
Examination Centre
Regional
Interview
Yes
Application Link
https://msmetcbhiwadi.org/Regist-Dipl-2023/

Note: This information is common for all posts. For details on specific posts, refer to the official notification.

Courses Released

1. Advance Diploma in Tool and Die making
2. Diploma in Mechatronics

Important Updates

Refer to the official notification for more details.

Application Summary

MSME Technology Centre Bhiwadi has released notifications for the Advance Diploma in Tool and Die making and Diploma in Mechatronics programs. Interested candidates can apply from 15/05/2023. Download the official prospectus for details on eligibility, program information, admission procedure, fee structure, and more.

MSME Technology Centre Bhiwadi invites online application from eligible candidates for admission in Diploma Programme. The important details of the admission process are listed below -


Course name:

  1. Advance Diploma in Tool & Die Making (ADTDM)

  2. Diploma in Mechatronics (DIM)

Essential Qualification: 10th/ SSC passed with Science and Maths with 50% marks in aggregate of all subjects (40% for the candidates belonging to SC/ST category).


For more details related to eligibility criteria, syllabus, fee, pattern, annexures etc refer to the attachments below.