Junior Research Fellow Post in DIAT via Direct Recruitment
Event Status : Created Event
Timeline
Important Dates
Application Opening Date | 27/10/2023 |
Application Closing Date | 27/10/2023 |
Date of Interview | 27/10/2023 |
Other Important Information
Appointment Type | Walk-In-Interview, Research Fellowship |
Application Submission Method | Offline |
Age Limit | 18-27 |
Qualification Required | Graduate, Postgraduate |
Total Vacancies | 1 |
Advertisement Number | 42-2023/JRF/DIAT (DU) |
Location of Posting/Admission | Pune District, Maharashtra, India, 412219 |
Exam | CSIR NET, GATE, UGC NET |
Interview | Yes |
Post Type | Contractual |
Work Experience | Yes |
Salary | 31000 |
Age Relaxation Type | SC/ST, Other Backward Class, Woman, Person with Benchmark Disabilities |
Website | https://www.diat.ac.in/ |
Organisation Type | Educational Institution |
Place of Posting/Admission | Pune, Maharashtra, India |
Note: This information is common for all posts. For details on specific posts, refer to the official notification.
Posts Released
Important Updates
Refer to the official notification for more details.
Application Summary
Defence Institute of Advanced Technology invites application from eligible candidates for Walk-in-Interview for the following post:
Post Name: Junior Research Fellow
Essential Qualification:
B.E./B.Tech in First Division with NET/GATE or
M.E./M.Tech in Metallurgical/ Materials/ Mechanical/ Nanotechnology/ Production Engineering/ Applied Physics or equivalent degree in First Division both at Graduate and Post graduate level. or
M.Sc./ M.S. in Physics/ Chemistry/ Material Science/ Nanoscience or equivalent degree in First Division with GATE/CSIR/UGC-NET qualification.
Desirable:
Understanding in Material Science & Engineering in general.
Experience in Metallurgical Characterization Equipment.
Writing and communication skills
Place of Interview: Defence Institute of Advanced Technology
For more details related to eligibility criteria, fee, pattern, annexures, place of posting etc. refer to the attachments below.