Exam Path Finder
Select Item
organisation_logo
  • Post-Doctoral Fellowship Post in Indraprastha Institute of Information Technology Delhi via Direct Recruitment

    Event Status : Created Event

Timeline

Important Dates

Date of Interview
30/09/2022
Application Closing Date
14/09/2022
Application Opening Date
01/09/2022

Other Important Information

Appointment Type
Direct Recruitment, Research Fellowship
Application Submission Method
Online
Age Limit
18-32
Qualification Required
Doctorate
Total Vacancies
4
Location of Posting/Admission
New Delhi, Delhi, India, 110011
Interview
Yes
Salary
60000, 75000
Post Type
Contractual
Organisation Type
Educational Institution
Place of Posting/Admission
New Delhi, Delhi, India
Website
https://www.iiitd.ac.in/

Note: This information is common for all posts. For details on specific posts, refer to the official notification.

Posts Released

1. Postdoctoral Fellowhip

Important Updates

Refer to the official notification for more details.

Application Summary

Indraprastha Institute of Information Technology Delhi has released a notification for the Postdoctoral Fellowhip post. Interested candidates can apply from 01/09/2022 to 14/09/2022. Download the official notification for details on eligibility, post information, job procedure, pay scale, and more.

Indraprastha Institute of Information Technology Delhi invites applications for the following post via direct recruitment:

Post Name: Post-Doctoral Fellowship

Eligibility:

  1. Ph.D. (Design or allied area) from a reputed institution/university anywhere in the world with a very good academic record throughout.

  2. Applicants must be capable of doing independent research work and have good record of publication in reputed international venues in HCI or related fields [CORE A/A*/JCR-Q1 etc.].

  3. Two letters of recommendation from a senior faculty/ head of the Department of your current/ last institution/ department.

For more details related to eligibility criteria, fee, pattern, annexures, place of posting etc. refer to the attachments below.