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  • Research Associate/ Research Assistant Post in MDU Rohtak via Walk-in-Interview

    Event Status : Created Event

Timeline

Important Dates

Date of Interview
30/10/2023
Application Closing Date
29/10/2023
Application Opening Date
20/10/2023

Other Important Information

Appointment Type
Walk-In-Interview
Application Submission Method
Online
Qualification Required
Postgraduate, Doctorate
Total Vacancies
1
Location of Posting/Admission
Rohtak District, Haryana, India, 124001
Exam
CSIR NET, UGC NET
Post Type
Contractual
Interview
Yes
Place of Posting/Admission
Rohtak, Haryana, India
Website
https://mdu.ac.in/
Organisation Type
Educational Institution
Salary
20000, 16000

Note: This information is common for all posts. For details on specific posts, refer to the official notification.

Posts Released

1. Research Associate
2. Research Assistant

Important Updates

Refer to the official notification for more details.

Application Summary

Maharshi Dayanand University Rohtak has released notifications for the Research Associate and Research Assistant posts. Interested candidates can apply from 20/10/2023 to 29/10/2023. Download the official notification for details on eligibility, post information, job procedure, pay scale, and more.

Maharshi Dayanand University Rohtak invites application from eligible candidates for Walk-in-Interview for the following posts:

Post Name: Research Associate / Research Assistant

Essential Qualification: M. Com/MBA/MA (Economics)/MSW with minimum 55 % marks (not less than 50% in the case of SC/ST) and NET/ M.Phil/ Ph.D.

Desirable:

• Preference will be given to the candidates having considerable research experience as evidenced by the dissertation or research articles.

• Specially dealing with the literature review, primary data collection.

• Analysis of the data and Report Writing.

Place of Interview: Room No: GF-5, IMSAR, Maharshi Dayanand University, Rohtak-124001

Application send via email to dahiyaseema@hotmail.com

For more details related to eligibility criteria, fee, pattern, annexures, place of posting etc. refer to the attachments below.