Junior Research Fellow Post in NIT Jalandhar via direct recruitment:
Event Status : Created Event
Timeline
Important Dates
Date of Interview | 03/04/2023 |
Application Closing Date | 01/04/2023 |
Application Opening Date | 21/03/2023 |
Other Important Information
Appointment Type | Direct Recruitment, Examination, Research Fellowship |
Application Submission Method | Online |
Qualification Required | Postgraduate, Doctorate |
Total Vacancies | 1 |
Advertisement Number | CRG/2020/002502 |
Location of Posting/Admission | Jalandhar District, Punjab, India, 144001 |
Exam | CSIR NET, GATE, UGC NET |
Work Experience | Yes |
Website | https://www.nitj.ac.in/ |
Organisation Type | Educational Institution |
Place of Posting/Admission | Jalandhar, Punjab, India |
Age Relaxation Type | SC/ST, Other Backward Class, Person with Benchmark Disabilities, Woman |
Salary | 31000 |
Interview | Yes |
Post Type | Contractual |
Note: This information is common for all posts. For details on specific posts, refer to the official notification.
Posts Released
Important Updates
Refer to the official notification for more details.
Application Summary
Dr B R Ambedkar National Institute of Technology Jalandhar invites applications for the following post via direct recruitment:
Post Name: Junior Research Fellow
Essential Qualification: The applicant should have M.E./M.Tech Degree in VLSI/Microelectronics Engineering/Electronics Engineering/ECE/ allied branches with minimum of first class from a reputed institute, preference should be given to GATE/NET qualified or PhD degree/Thesis submitted in relevant field or In case class is not specified in degree then minimum 60% marks or 7.0 CGPA will be considered as 1st class. The experienced/Higher qualification person may be eligible for higher fellowship.
Desirable: Working knowledge of TCAD/CADANCE/SYNOPSYS and MATLAB will be an added advantage.
Application send via email to ramana@nitj.ac.in
For more details related to eligibility criteria, fee, pattern, annexures, place of posting etc. refer to the attachments below.