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  • Junior Research Fellow Post in IIITDM Jabalpur via Walk-In-Interview

    Event Status : Created Event

Timeline

Important Dates

Date of Interview
10/07/2023
Application Closing Date
03/07/2023
Application Opening Date
14/06/2023

Other Important Information

Appointment Type
Walk-In-Interview, Research Fellowship
Application Submission Method
Online
Age Limit
18-32
Qualification Required
Postgraduate, Graduate
Total Vacancies
1
Location of Posting/Admission
Jabalpur District, Madhya Pradesh, India, 483222
Exam
CSIR NET, GATE, UGC NET
Salary
31000
Interview
Yes
Age Relaxation Type
SC/ST, Other Backward Class, Person with Benchmark Disabilities, Woman
Organisation Type
Educational Institution
Website
https://www.iiitdmj.ac.in/
Place of Posting/Admission
Jabalpur, Madhya Pradesh, India
Post Type
Contractual

Note: This information is common for all posts. For details on specific posts, refer to the official notification.

Posts Released

1. Junior Research Fellow

Important Updates

Refer to the official notification for more details.

Application Summary

Indian Institute of Information Technology Design and Manufacturing Jabalpur has released a notification for the Junior Research Fellow post. Interested candidates can apply from 14/06/2023 to 03/07/2023. Download the official notification for details on eligibility, post information, job procedure, pay scale, and more.

Indian Institute of Information Technology Design and Manufacturing Jabalpur invites application from eligible candidates for Walk-in-Interview for the following post:

Post Name: Junior Research Fellow

Essential Qualification: MSc/M Tech in Physics OR BE/B Tech/ME/M Tech in ECE/relevant discipline with NET/GATE or equivalent.

Desirable: Candidates having knowledge of Quantum Communications, MATLAB and Mathematical Modeling of Communication Systems, will be given preference.

Application send via email to atul.kumar@iiitdmj.ac.in

For more details related to eligibility criteria, fee, pattern, annexures, place of posting etc. refer to the attachments below.