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  • Senior Research Fellow Post in National Institute of Food Technology Entrepreneurship and Management via Direct Recruitment

    Event Status : Created Event

Timeline

Important Dates

Date of Interview
01/04/2022
Application Closing Date
30/03/2022
Application Opening Date
25/03/2022

Other Important Information

Appointment Type
Direct Recruitment, Research Fellowship
Application Submission Method
Online
Age Limit
18-27
Qualification Required
Postgraduate
Total Vacancies
2
Location of Posting/Admission
Sonipat District, Haryana, India, 131024
Website
www.niftem.ac.in
Organisation Type
Educational Institution
Post Type
Contractual
Interview
Yes
Age Relaxation Type
SC/ST, Other Backward Class
Salary
31000
Work Experience
Yes
Place of Posting/Admission
Kundli, Sonipat, Haryana, India

Note: This information is common for all posts. For details on specific posts, refer to the official notification.

Posts Released

1. Senior Research Fellow

Important Updates

Refer to the official notification for more details.

Application Summary

National Institute of Food Technology Entrepreneurship and Management has released a notification for the Senior Research Fellow post. Interested candidates can apply from 25/03/2022 to 30/03/2022. Download the official notification for details on eligibility, post information, job procedure, pay scale, and more.

National Institute of Food Technology Entrepreneurship and Management invites applications for the following post via direct recruitment:


Post Name : Senior Research Fellow


Essential Qualification : ME/M.Tech in Food Engineering and Management/ Food Technology and Management/Food Supply Chain Management/ Mechanical Engineering/ Refrigeration and Air-conditioning or Equivalent in relevant specialization


Essential Work Experience : Experience in the Cold chain technology management and logistic


Application can be sent via email to pkprabhakarniftem@gmail.com


For more details related to eligibility criteria, fee, pattern, annexures, place of posting etc. refer to the attachments below.