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  • Platemaker Post in Department of Economic Affairs via Deputation/Absorption

    Event Status : Created Event

Important Dates

Application Closing Date
28/03/2023
Application Opening Date
28/01/2023

Other Important Information

Appointment Type
Deputation, Absorption
Application Submission Method
Offline
Qualification Required
Matriculate
Total Vacancies
1
Advertisement Number
A.12011/2/2019-Ad.IA
Location of Posting/Admission
New Delhi, Delhi, India, 110011
Post Type
Contractual
Work Experience
Yes
Group
Group C
Pay Matrix
Level 4, Grade Pay 2400
Salary
47043
Website
https://dea.gov.in/
Organisation Type
Non-Educational Institution
Place of Posting/Admission
New Delhi, Delhi, India

Note: This information is common for all posts. For details on specific posts, refer to the official notification.

Posts Released

1. Plate Maker

Important Updates

Refer to the official notification for more details.

Application Summary

Department of Economic Affairs has released a notification for the Plate Maker post. Interested candidates can apply from 28/01/2023 to 28/03/2023. Download the official notification for details on eligibility, post information, job procedure, pay scale, and more.

Department of Economic Affairs invites applications for the following post via Deputation/ Absorption:

Post Name: Platemaker

Eligibility:

  • Person holding the analogous post on regular basis or;

  • Persons in the scale (pre-revised) of 3050-4590 having 8 years of regular service in the grade.

Essential Qualification:

  • Matriculation or its equivalent.

  • A certificate of successful completion of apprenticeship in the trade under Apprentices Act, 1961 (52 of 1961).

  • Three years experience in platemaking in a press of repute.

Address to send the application: The Candidate must fill in the application form and send it to the Santosh Kumar, Under Secretary to the Government of India along with relevant documents.

For more details related to eligibility criteria, fee, pattern, annexures, place of posting etc. refer to the attachments below.