Technical Assistant and 4 Other Post in ICAR IIMR via Direct Recruitment
Event Status : Created Event
Timeline
Important Dates
Date of Interview | 14/08/2023 |
Application Closing Date | 10/08/2023 |
Application Opening Date | 26/07/2023 |
Other Important Information
Appointment Type | Direct Recruitment |
Application Submission Method | Online |
Age Limit | 18-35 |
Qualification Required | Doctorate, Postgraduate, Graduate, Diploma |
Total Vacancies | 7 |
Location of Posting/Admission | Ranga Reddy District, Telangana, India, 501106 |
Place of Posting/Admission | Rajendranagar, Hyderabad, Telangana, India |
Website | https://www.millets.res.in/ |
Organisation Type | Non-Educational Institution |
Post Type | Contractual |
Department/Subject | Marketing, Processing, Value Addition |
Interview | Yes |
Age Relaxation Type | SC/ST, Woman, Other Backward Class |
Work Experience | Yes |
Salary | 15000, 20000, 30000, 31000, 49000 |
Note: This information is common for all posts. For details on specific posts, refer to the official notification.
Posts Released
1. Technical Assistant
2. Information Technologist
3. Senior Research Fellow
4. Project Coordinator-II
5. Expert
Important Updates
Refer to the official notification for more details.
Application Summary
ICAR Indian Institute of Millets Research has released job notifications for 5 posts, including Technical Assistant, Information Technologist, and others. Interested candidates can apply from 26/07/2023 to 10/08/2023. Download the official notification for details on eligibility, post information, job procedure, pay scale, and more.
ICAR Indian Institute of Millets Research invites applications for the following posts via direct recruitment :
Post Name :
(1) Technical Assistant
(2) Information Technologist
(3) Senior Research Fellow
(4) Project Coordinator-II
(5) Expert (Marketing, Processing and Value Addition)
Application send via email to iimrfpo@gmail.com
For more details related to eligibility criteria, fee, pattern, annexure, place of posting etc. refer to the attachments below.