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  • Apprenticeship Training Program Admission in Telecommunications Consultants India Limited For Academic Session 2022

    Event Status : Created Event

Timeline

Important Dates

Application Closing Date
07/04/2022
Application Opening Date
29/03/2022

Other Important Information

Admission Bases
Training
Application Submission Method
Composite
Qualification Required
Graduate
Stream
Others
Application Fee
Yes
Location of Posting/Admission
New Delhi, Delhi, India, 110011
Website
https://www.tcil.net.in
Organisation Type
Non-Educational Institution
Age Limit
18-28
Age Relaxation Type
SC/ST, Other Backward Class
Educational Credential Awarded
Degree
Place of Posting/Admission
New Delhi, Delhi, India
Salary
9000
Interview
Yes

Note: This information is common for all posts. For details on specific posts, refer to the official notification.

Courses Released

1. Apprenticeship Training Program

Important Updates

Refer to the official notification for more details.

Application Summary

Telecommunications Consultants India Limited has released a notification for the Apprenticeship Training Program program. Interested candidates can apply from 29/03/2022 to 07/04/2022. Download the official prospectus for details on eligibility, program information, admission procedure, fee structure, and more.

Telecommunications Consultants India Limited invites online application from eligible candidates for admission in Apprenticeship Training Program. The important details of the admission process are listed below -


Course name : Apprenticeship Training Program


Educational Qualification : Full-time Three years LLB or Five years integrated Law/LLB course approved by Bar Council of India


Address to send the application: Candidate must fill in the application form and send it to The General Manager (HRD), TCIL Bhawan, Greater Kailash-I, New Delhi-110048


Application can also be sent via email to  tcilapprentice2021@gmail.com


For more details related to eligibility criteria, syllabus, fee, pattern, annexures etc refer to the attachments below.