Senior Consultant (Legal) and 1 Other Post in NIELIT via Direct Recruitment
Event Status : Created Event
Timeline
Important Dates
Application Closing Date | 20/10/2023 |
Application Opening Date | 13/10/2023 |
Other Important Information
Appointment Type | Direct Recruitment |
Application Submission Method | Offline |
Age Limit | 18-56 |
Qualification Required | Graduate |
Total Vacancies | 3 |
Advertisement Number | I-11011/6/2023-O/o Registrar (E-3115301) |
Location of Posting/Admission | New Delhi, Delhi, India, 110011 |
Department/Subject | Legal |
Work Experience | Yes |
Place of Posting/Admission | New Delhi, Delhi, India |
Organisation Type | Non-Educational Institution |
Website | https://www.nielit.gov.in/ |
Salary | 70000, 45000 |
Interview | Yes |
Post Type | Contractual |
Note: This information is common for all posts. For details on specific posts, refer to the official notification.
Posts Released
Important Updates
Refer to the official notification for more details.
Application Summary
National Institute of Electronics and Information Technology invites applications for the following posts via direct recruitment:
Post Name: Senior Consultant (Legal)
Essential Qualification: LLB Degree from recognized University.
Essential Work Experience: At least 10-15 years of working experience in handling legal matters in Govt department / repute private Organization.
Post Name: Junior Consultant (Legal)
Essential Qualification: LLB Degree from recognized University.
Essential Work Experience: At least 5-7 years of working experience in handling legal matters in Govt. department / reputed private Organization.
Address to send the application: The Candidate must fill in the application form and send it to Registrar, National Institute of Electronics & Information Technology (NIELIT) NIELIT Bhawan, Plot No. 3, PSP Pocket, Institutional Area Sector-8, Dwarka, New Delhi-
110077 along with relevant documents.
For more details related to eligibility criteria, fee, pattern, annexure, place of posting etc. refer to the attachments below.