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  • Research Assistant Post in University of Hyderabad via Direct Recruitment

    Event Status : Created Event

Timeline

Important Dates

Application Closing Date
24/04/2023
Application Opening Date
06/04/2023

Other Important Information

Appointment Type
Direct Recruitment
Application Submission Method
Offline
Age Limit
18-40
Qualification Required
Postgraduate
Total Vacancies
2
Advertisement Number
UoH-IoE-RC5-22-016
Location of Posting/Admission
Hyderabad District, Telangana, India, 500028
Post Type
Contractual
Quota/Reservation
Economically Weaker Sections, Other Backward Classes
Website
https://uohyd.ac.in/
Place of Posting/Admission
Hyderabad, Telangana, India
Organisation Type
Educational Institution
Salary
20000

Note: This information is common for all posts. For details on specific posts, refer to the official notification.

Posts Released

1. Research Assistant

Important Updates

Refer to the official notification for more details.

Application Summary

University of Hyderabad has released a notification for the Research Assistant post. Interested candidates can apply from 06/04/2023 to 24/04/2023. Download the official notification for details on eligibility, post information, job procedure, pay scale, and more.

University of Hyderabad invites applications for the following post via direct recruitment:

Post Name: Research Assistant

Essential Qualification:

1. MCA/ME/MTech/MSc. in Computer Science or related areas with 55% minimum from a recognized Indian University.

2. Basic Knowledge of Graph Theory and Algorithms

3. Good communication skills in English

4. Students pursuing ME/M.Tech can also apply

Desirable: Programming Skills

Address to send the application: The Candidate must fill in the application form and send it to the Dean, School of Computer and Information Science, (IP Dr Swami), University of Hyderabad, Prof C.R.Rao Road, Gachibowli, Hyd-500046 along with relevant documents.

For more details related to eligibility criteria, fee, pattern, annexures, place of posting etc. refer to the attachments below.